Na'urorin lantarki X-ray Testing Station
XT V 130

Compact zane, m aiki, multi-aiki kananan lantarki sassa ingancin tabbatar da bincike tsarin

Ga ci gaba da bayyana na'urorin lantarki masu sabuntawa, gwajin farfajiyar ba zai iya biyan buƙatun gwajin abokin ciniki na yanzu ba. Saboda ba za a iya lura kai tsaye da ƙarancin haɗin haɗin kewayoyin lantarki na ciki ba, gano lokacin X-ray mai inganci yana da mahimmanci da inganci. XTV130 X-ray ganowa tsarin da aka tsara musamman don BGA ganowa, multi-layers PCB welding ganowa, sa rashin daidaito ganowa bincike na PCB kewaye allon zama mafi sauri da sassauci. An tsara Inspect-X software don ba da damar ganowa ta atomatik da kuma ganowa ta atomatik na allon kewayawa (na zaɓi) don samun ingantaccen aikin ganowa.

Babban fasali

• Musamman micro mayar da hankali gunsource tare da mayar da hankali girma na 3 microns
• 16-bit launi zurfin high ƙuduri image da kuma image aiki kayan aiki
• Babban trays da za a iya sanya da yawa samfurin kewaye allon lokaci guda
• Kulawa da kusurwar karkata har zuwa 60 °
• juyawa samfurin tray (360 ° ci gaba juyawa) (zaɓi)

Up zuwa 320 sau a kan sha'awar lura da yankunan zoom
Matsakaicin karkata 60 ° mai sassauci na iya gano matsalolin stereo haɗin

gabatar da ayyuka

• Tashar aiki ta X-ray don tabbatar da ingancin kayan lantarki
• Babu buƙatar musamman shirye-shirye fasahohin macro-tushen sarrafa kansa aiki
• Yanke shawara ta atomatik don halayen sassa, ganewar gani na offline da samar da rahoto
• VBA-tushen zai sa hadaddun tsari zama mai sauki sarrafa kansa
• Multi-axis shugabanci bar sa online kewayawa mafi intuitive
• Fasahar buɗewar X-ray ta sa kuɗin kulawa ya zama mafi arha
• Tsarin tsaro na masu auna haske wanda ba ya buƙatar ƙarin kariya
• Mai ɗaukar ƙananan sarari, mai nauyi mai sauki, da sauƙin saitunan shigarwa

Amfani

BGA kuskure ganowa
• Electronic sassa, kewaye sassa
• Zinare waya Pin haɗi gazawar maki, spherical karya walda maki, zinariya waya radius, guntu-guntu haɗuwa, bushe haɗuwa, gada / gajeren kewaye, ciki kumfa, BGA da sauransu
• PCB kafin / bayan taro
• Matsayi karkatarwa na sassa, walda gaps, gada, surface taro da sauran lalacewa nuni
• Through rami rufi, Multi Layer tsari cikakken dubawa
• Wafer chip-grade kwakwalwan kwamfuta size kunshin (WLCSP)
• BGA da kuma CSP ganowa
• Non-gubar welding dubawa
• Micro-electromechanical tsarin MEMS, Micro-photoelectric tsarin MOEMS
• Cables, connectors, roba sassa da sauransu